CHINA-TECHNOLOGY: CHINESE TECH COMPANY CLAIMS IT WILL CATCH UP WITH FOREIGN SEMICONDUCTOR MANUFACTURERS IN A YEAR
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Caixin reported (April 15) that the up-and-coming Yangtze Memory Technologies Co. Ltd. unveiled its latest 3D NAND memory chip with cutting-edge 128-layer technology as it plays catch-up with global leaders like Samsung in China’s drive to become a semiconductor powerhouse. The company, based in the city of Wuhan, said its new chip, the X2-6070, has passed sample verification with several partners and could start mass production by end of this year or in the first half of 2021. The rollout makes it China’s first NAND chip using 128-layer technology, where the number of layers determines the density of data storage. Yangtze Memory is currently about a generation behind many of its global peers but is closing the gap.
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